Packaging is critical to LED reliability


The trend of energy saving and environmental protection has brought more LED demand, and the continuous maturity of technology has promoted the popularization of LED products. In the past two years, the market for LED display, backlight and lighting has grown rapidly. More companies have entered this field and are expanding their production capacity. China has become one of the major countries in the world for LED package manufacturing.

Packaging is critical to LED reliability

Packaging technology is closely related to LED reliability

LED street lights have energy saving advantages and reliability needs to be further improved

Technically, the main factor driving the development of LED applications is the improvement of chip light efficiency. Industry expert and general manager of Shenzhen Lehman Optoelectronics Technology Co., Ltd. Li Mantie told reporters that the light efficiency of LED chips has been continuously improved recently, and the 1W high-power products supplied by the market have reached more than 100lm/W.

Packaging technology is another important factor, although it is not obvious for improving LED light efficiency, but it is closely related to the reliability of LED. Zhang Yanwei, vice president of research and development at China Micro-Optical Electronics (Weifang) Co., Ltd. said that the difference in packaging technology directly affects the quality of LEDs. Good packaging and heat dissipation technology can make LEDs work below 60 °C junction temperature and have a lifetime of more than 50,000 hours. The poor packaging technology will shorten the LED life by more than half. "90% of LED efficacy depends on the luminous efficiency of the chip, 10% depends on the package structure and the excitation efficiency of the phosphor; LED reliability is 30% depends on the chip, 70% depends on the packaging process, packaging material, package structure and package management LED heat dissipation is 50% depending on the chip structure, 50% depends on the package heat dissipation structure design and heat sink material selection." Li Mantie concluded.

In the field of LED lighting, which is widely concerned in the industry, advances in packaging technology are particularly important. At present, the improvement of chip light efficiency makes the efficiency of some high-efficiency LED street lamps reach 80 lm/W or more, which has the advantage of energy saving, and its reliability and service life need to rely on packaging technology to further improve. Li Mantie said that the current bottleneck of LED street lights is not light efficiency, but in the light decay and reliability, the package of high-power LEDs for street lamps plays a key role in the light decay and reliability of LED street lamps.

Chen Hesheng, president of Anhui Zerun Optoelectronics Co., Ltd., believes that for LED street lamps, the packaging industry can do limited work in improving light efficiency. It is more dependent on the advancement of chip technology; it is improving stability and reliability. Sexuality, consistency, etc. are very important (more on process control), because LED devices are used in street lighting applications, and any solution needs to be applied to series-parallel technology, which leads to hundreds of street lamps. In the device, as long as one device has a problem, it will affect the current and voltage thresholds in the original design, which will affect the working state of the whole lamp, making the LED's claimed 10- to 15-year service life become empty talk. Therefore, he believes that in this sense, the control of the failure rate of high-power LED devices must be very strict, which is the top priority of the packaging industry.

Need to strengthen key mechanism research

Basic materials and heat dissipation technology are gradually improving

Key mechanism research still needs to be strengthened

In the past, factors restricting the development of LED packaging technology are believed to exist mainly in the following three aspects: First, the performance of key packaging materials such as substrate materials, organic rubber (silica gel, epoxy resin), phosphors, etc. needs to be improved; The heat dissipation problem of power LED packaging technology has not been completely solved; the third is that the package structure should be innovative for different applications. At present, is there a significant improvement in the domestic LED packaging industry in these areas? "Basic materials and heat dissipation technology are gradually improving, but the improvement is not obvious. The current cost-effectiveness of LED packaging products is more dependent on the cost-effectiveness of the main raw materials - LED chips; Innovation is not very obvious. It is more manifested in the improvement of the process to adapt to the application requirements. At present, the packaging and application have not reached the realm of full integration." Chen Hesheng said. Therefore, he believes that since 2009, the domestic LED industry's progress in the main indicators of packaging technology has become more of a qualitative change, and there has not been a breakthrough in qualitative change.

Li Mantie said that with the improvement of the package structure design and the use of a large number of new heat dissipation materials, the light attenuation control and reliability improvement of the LED package level has reached a new level. However, he believes that the research and mastery of the key mechanisms of LED packaging technology by domestic enterprises is not enough, and the accumulation of independent intellectual property rights is insufficient. He believes that the domestic LED packaging industry needs to pay more attention to key packaging materials, including high-performance epoxy resin, high-performance silica gel, new heat-dissipating materials, new fluorescent materials, and new brackets. He told reporters that Lehman Optoelectronics therefore established the Lehman Optoelectronic Materials R&D Center at China University of Geosciences, and together with the Ph.D. group in the field of materials chemistry to study the key mechanisms of packaging materials technology, and accumulated a series of patented technologies.

At present, the LED application market is continuing to grow rapidly, and packaging companies are expanding their production capacity to meet market demand. However, in this market development opportunity, enterprises can only gain more breakthroughs in the encapsulation of key technologies and achieve more sustainable development. (Edit: Led Fish)

WiFi 5 Ceiling Wireless AP

Wireless Access Point (AP) is a new type of wireless network device, it is a network device based on Wi-Fi technology, can convert a wired network into a wireless network, so that you can easily access the network at home, office or public places. The feature of wireless ceilinged AP is that it uses ceilinged design, can be suspended on the wall top or ceiling, and can transmit the signal to a wider range, so that users can have more space in the same building.

Second, the advantages of wireless ceiling AP

1, the advantage of wireless ceiling AP is that it can better meet the requirements of various environments, can better meet the requirements of indoor space, can better meet the requirements of outdoor space, and can better meet the multi-level coverage area.

2, wireless ceiling AP can better meet the requirements of more network users, because it can better support multiple users, and can meet the connection of a variety of network devices, such as can support the connection of computers, smart phones, tablets and other devices.

3, wireless ceiling AP can better meet a variety of network security needs, because it can provide a variety of network security functions, including encrypted transmission, network isolation, access control, content filtering, authentication and other functions, can better protect network security.


Third, the application of wireless ceiling AP

Wireless ceiling AP can be widely used in homes, offices, companies, schools, hotels, restaurants, public places and other places to meet the network needs of different places.

1, Family: Wireless ceiling AP can better meet the network needs of the family, can make the family network coverage larger, family members can more convenient access to the network at home, more secure access to the network.

2, office: Wireless ceiling AP can meet the network needs of the office, can better meet the network needs of multiple users inside the office, can better meet the network needs of multiple users outside the office, can better support the office security network needs.

3, the company: wireless ceiling AP can better meet the company's network needs, can better meet the company's internal network needs of multiple users, can better support the company's security network needs, can better meet the company's external user network needs.

Fourth, the use of wireless ceiling AP

The installation of wireless ceiling AP is very simple, only need to install it on the wall top or ceiling, and then connect it to the network interface, and finally use its configuration software to complete the installation and setup, the use of wireless ceiling AP is very convenient, as long as the network function is enabled, you can allow multiple users to easily access the network in the same building.

Wifi 5 Ceiling Wireless Ap,Wifi Access Point Poe Ceiling Mount,Ceiling Mount Wifi Access Point Home,Access Point Enclosure Ceiling

Shenzhen MovingComm Technology Co., Ltd. , https://www.szmovingcomm.com